High purity titanium sputtering targets

Product Introduction 

High Purity Titanium Sputtering Targets — Premium PVD Source Material for Semiconductor & Advanced Coating Applications

Baoji Huacan's high purity titanium sputtering targets are precision-engineered PVD source materials designed for semiconductor, flat panel display, solar, and advanced coating applications. Available in purity grades from 99.5% to 99.995%, these targets deliver uniform density, low oxygen content, and fine grain structure to ensure consistent thin film performance. Whether you need standard dimensions or fully customized geometries, our targets are manufactured to your exact specifications — including diameter, thickness, and backing plate compatibility.

Product Features

Parameter	Specifications
Material	High-Purity Titanium (Ti)
Purity	99.5%–99.995% (2N5–4N5)
Density	Approx. 4.506 g/cm³
Grain Size	≤ 100 μm
Oxygen Content	≤ 500 ppm
Dimensions	Custom sizes available: diameter, length, width, and thickness
Shape	Round, rectangular, or custom-designed to drawings
Backing Plate Materials	Copper (Cu), molybdenum (Mo), or stainless steel (SS)
Bonding Options	Diffusion bonding or solder bonding
Surface Finish	Machined or polished according to customer requirements
Compatible Coating Systems	PVD, magnetron sputtering, and vacuum coating systems
Applicable Standards	ASTM, AMS, or other specifications upon request
Customization	Purity, dimensions, bonding, and surface finish can be customized to project requirements

Product Application

Semiconductor ICs (Logic & Memory): Titanium films serve as barrier metals and adhesion layers between silicon and metal interconnects. At 7nm and 5nm nodes, target purity directly impacts circuit yield.

Flat Panel Displays (TFT-LCD & OLED): Used for gate and electrode deposition on large-area glass. Uniform grain structure ensures consistent pixel response across 4K and 8K panels.

Photovoltaics & Solar Cells: Titanium coating layers improve contact adhesion and anti-reflection performance in thin-film solar modules.

Optics & Decorative Coatings: Applied in optical interference stacks and decorative PVD coatings requiring precise, repeatable film properties.

Advanced Packaging (TSV): High purity titanium sputtering targets support wetting layer deposition inside high-aspect-ratio through-silicon vias for 3D chip stacking.

Why Choose Us

Our titanium targets are produced from virgin sponge-grade raw material. This eliminates trace contaminants that cause film defects in nanometer-scale processes.

We control grain size to <100μm with uniform equiaxed structure throughout. This prevents uneven erosion patterns and maintains a stable deposition rate across the full target lifetime.

Manufacturing Process

Vacuum arc remelting (VAR) and plasma arc melting (PAM) are used to purify titanium ingots with a high chemical homogeneity and a low level of impurities from the very beginning.

Once melted the material is worked and rolled in a controlled manner to improve the grain structure. The desired equiaxed microstructure and density is obtained by heat treatment.

With more than 40 CNC machining centers, we carry out the final shaping, guaranteeing strict dimensional tolerances and fine surface finishes. Each target is then cleaned, examined and vacuum packaged for transportation.

Receiving Drawings

Annealing

Developing Machining Process

Finish Machining

Preparing Raw Materials

Deburring

Rough Machining

Deburring

Manufacturing Capability

Our facility in Baoji — China's Titanium Valley — operates with 10+ years of titanium processing experience and an annual production capacity exceeding 1,000 tons.

We maintain 40+ precision CNC machines including machining centers and gantry systems for tight-tolerance target shaping. Our melting and forging capabilities handle ingot production from scratch, giving us full control over material quality from raw sponge to finished target.

melting	melting	forging	forging	rolling

Quality Control

Our multi-stage QC process covers every critical inspection point:

· GDMS analysis — verifies trace metallic impurities at ppb level

· LECO analysis — measures gaseous impurities including oxygen, nitrogen, and carbon

· Ultrasonic C-Scan — confirms bonding ratio >98% for bonded target assemblies

· Metallographic inspection — verifies grain size and uniformity via cross-section analysis

· CMM dimensional verification — tolerances within ±0.1mm for tool fitment accuracy

· Surface inspection — roughness measurement and visual defect screening before packaging

Packaging & Shipping

Each target is vacuum-sealed with desiccants to prevent surface oxidation during transit. Custom foam inserts protect the precision-machined surfaces from mechanical damage.

Bulk orders are packed in sturdy wooden crates with full labeling and documentation for easy customs clearance and traceability. Air freight is available for urgent orders; sea freight supports cost-effective bulk shipments.

FAQ

Q: Why does grain size matter for titanium sputtering targets?

A: Fine, uniform grains ensure a constant erosion rate across the target life. Non-uniform grains cause varying deposition rates and nodule formation, which leads to particulate defects in thin films.

Q: What is the difference between diffusion bonding and solder bonding?

A: Solder bonding uses indium and works at lower temperatures. Diffusion bonding forms a solid-state atomic weld, delivering superior thermal transfer — essential for high-power semiconductor processes.

Q: Can you supply product made from recycled material?

A: For semiconductor-grade applications, we use virgin titanium sponge refined via VAR or PAM. This guarantees the trace element control and low alpha-particle emission required by advanced process nodes.

Q: What are your storage requirements for unused targets?

A: Targets are vacuum-packed to prevent oxidation. Shelf life is indefinite if the seal remains intact. Store in a climate-controlled environment to avoid thermal stress on the bond interface.

Q: What documentation can you provide with each order?

A: We provide material test certificates, GDMS purity reports, CMM dimensional reports, and COC documentation. Additional certifications can be arranged based on your requirements.

Contact Us

Ready to source precision titanium targets like high purity titanium sputtering targets? Send your drawings or specifications to sherry@hc-titanium.com and get a fast quote.