Customized Titanium Target for PVD Sputtering — High-Purity, Precision-Engineered Solutions

Baoji Huacan's customized titanium target is engineered for demanding PVD sputtering applications, offering purity grades from 99.5% to 99.995%. Each target delivers uniform density exceeding 99.7% of theoretical density, ensuring stable sputtering rates and consistent thin film quality. With fine equiaxed grain sizes often below 30µm and dimensional tolerances within ±0.1mm, these targets are built to perform in semiconductor, optics, solar, and decorative coating environments.

Parameter	Details
Material Grade	Grade 1 / Grade 2 (Commercially Pure Titanium), Grade 5 (Ti-6Al-4V), Grade 7, Grade 9, Grade 23 (Ti-6Al-4V ELI)
Material Purity	Up to 99.995% (5N) for high-purity titanium targets
Density Ratio	≥99.7% of theoretical density
Grain Structure	Fine and uniform grain structure; average grain size <30 μm
Chemical Composition	Controlled composition with full material traceability available
Surface Roughness (Ra)	≤0.8 μm or customized according to sputtering requirements
Dimensional Tolerance	±0.1 mm or according to customer drawings and equipment requirements
Target Shape	Planar targets, Rotatable targets, Step targets, Convex targets, and custom geometries
Target Dimensions	Customized diameter, length, width, thickness, and mounting configurations
Backing Plate Options	Copper (Cu), Molybdenum (Mo), Stainless Steel, or customized materials
Bonding Methods	Indium bonding, Elastomer bonding, Diffusion bonding, and other customized solutions
Material Standards	ASTM, AMS, DIN, ISO, or customer-specific specifications
Surface Finish	Machined finish, polished finish, or customized surface treatment
Inspection & Quality Control	Dimensional inspection, material analysis, density testing, surface inspection, and traceability documentation

Titanium Target

High Purity, Low Contamination

Purity ranges from 99.5% to 99.995%, with oxygen content strictly below 500 ppm. This minimizes chamber contamination and supports high-yield semiconductor and optics processes.

Controlled Grain Structure

Fine equiaxed grains below 30µm with optimized crystallographic texture enhance sputtering yield and ensure film thickness uniformity across the substrate.

Excellent Thermal Stability

Targets perform reliably under continuous high-power sputtering conditions without deformation or bonding failure, especially when diffusion bonding is selected for high-throughput lines.

Wide Process Compatibility

Compatible with PVD, CVD, magnetron sputtering, and cathodic arc evaporation systems for customized titanium target. Suitable for both planar and rotatable configurations.

Product Comparison

Feature	Customized Titanium Target	Standard Off-the-Shelf Target
Target Geometry	Planar, Rotatable, Step, Convex, and other custom geometries	Mainly standard planar or fixed configurations
Purity Options	Customized purity levels available from 99.5% to 99.995% depending on application requirements	Standard purity grades with limited selection
Grain Structure Control	Fine and uniform grain structure with controlled grain size (e.g. <30 μm)	Based on standard production specifications
Bonding Options	Indium bonding, Elastomer bonding, Diffusion bonding, and customized solutions	Limited bonding options depending on supplier capability
Dimensional Accuracy	Manufactured according to customer drawings with precision tolerances (e.g. ±0.1 mm)	Standard dimensions and tolerances
OEM / Custom Manufacturing	Full OEM support for customized designs, dimensions, and mounting requirements	Usually limited to catalog specifications
Material Options	Pure titanium, Ti-Al alloys, Ti-6Al-4V, and other titanium alloys available	Mainly standard pure titanium grades
Application Adaptability	Optimized for semiconductor, coating, optical, and specialized sputtering applications	Suitable for general sputtering applications

Semiconductor Interconnects

Titanium Target Application

Architectural Low-E Glass Coating

Titanium target application

Solar & Optics

Titanium target Application

Semiconductor Interconnects

5N purity titanium targets deposit ultra-thin Ti adhesion and barrier layers in IC fabrication. Grain alignment ensures uniform step coverage in high-aspect-ratio vias, preventing electromigration in advanced microchips.

Architectural Low-E Glass Coating

Large-format rotatable targets deposit TiO₂ layers across wide glass panels. Custom tube lengths exceeding 3 meters ensure consistent optical properties for energy-efficient architectural glass.

Wear-Resistant Tool Coatings

Titanium targets — including alloy compositions such as TiAl — are used to form TiN and TiAlN hard coatings on cutting tools and molds, significantly extending service life under high-power cathodic arc or magnetron sputtering.

Solar & Optics

Used in anti-reflection and transparent conductive oxide coatings for photovoltaic panels and precision optical lenses.

Standard off-the-shelf targets often cause low target utilization rates, arc discharging, and uneven film thickness. Our titanium targets are tailored to your specific vacuum chamber geometry, film requirements, and process parameters.

You get full control over purity, bonding method, grain structure, and dimensions — all backed by 10+ years of titanium machining experience and 1,000+ tons of annual production capacity.

Production begins with high-purity titanium ingot preparation using vacuum arc remelting (VAR) and plasma arc melting (PAM) to achieve low impurity levels and excellent chemical homogeneity.

Ingots are then processed through precision forging and rolling. This refines the grain structure and achieves the fine, equiaxed microstructure critical for uniform sputtering performance.

CNC precision machining is the final shaping stage. Using 40+ advanced CNC machining centers, each target is machined to your exact dimensional drawing, with flatness, concentricity, and surface roughness tightly controlled.

Bonding to the backing plate — Cu, Mo, or stainless steel — is performed using your specified bonding method, whether Indium, Elastomer, or Diffusion bonding, to match your equipment's thermal and power density requirements.

Receiving Drawings

Annealing

Developing Machining Process

Finish Machining

Preparing Raw Materials

Deburring

Rough Machining

Deburring

Capability	Details
Annual Production Capacity	1,000+ tons of titanium products and precision components annually
CNC Machining Capability	40+ CNC machines, including lathes, machining centers, and gantry machining systems for complex titanium parts
Melting Capability	5,000+ tons/year capacity with VAR (Vacuum Arc Remelting) and PAM (Plasma Arc Melting) technologies
Forging Capability	3,000+ tons/year titanium forging capacity with large-scale forging equipment
Manufacturing Flexibility	Prototype development, small batch production, and high-volume manufacturing
Global Customer Experience	100+ international customer collaborations across multiple industries
Quality & Traceability	Material traceability, dimensional inspection, and quality documentation available for customer requirements


melting	melting	forging	forging	rolling

Every customized titanium target passes a structured multi-stage inspection before shipment.

Chemical Composition — Verified using GDMS or ICP-OES, confirming purity and controlling trace impurities including O, N, C, H, and Fe down to ppm levels.

Ultrasonic C-Scan Testing — Confirms bonding integrity between target and backing plate, achieving bonding ratios >95%, with Class A requirements reaching >98%.

Metallographic Examination — Grain size measured per ASTM E112, ensuring a recrystallized, defect-free microstructure.

Dimensional Inspection — CMM verification of flatness, concentricity, and all critical tolerances per your drawing.

Surface Cleanliness — Oil-free and fingerprint-free surfaces confirmed before vacuum packaging.

Mechanical Properties Testing

Inner Diameter Measurement

Ultrasonic Testing

CMM Dimensional

Mounting Hole Diameter Measurement

Quality Management System Certification

Method	Details
Primary Protection	Vacuum-sealed bags with desiccants
Cushioning	Custom foam inserts for fragile or precision assemblies
Outer Packaging	Sturdy wooden crates for bulk or international shipment
Documentation	Full labeling, MTC, inspection reports, traceability records
Shipping Options	Air freight (urgent orders), sea freight (bulk cost-effective)

Q: What data do I need to submit a custom order?

A：Please provide your equipment model, target geometry, purity grade, dimensional drawing, bonding method preference, and end application. This allows us to optimize the microstructure and bonding for your process.

Q: How does grain size affect sputtering performance?

A：Finer, uniform grains below 30µm produce consistent sputtering rates across the target surface, directly improving film thickness uniformity and reducing deposition variance.

Q: Can you produce alloy titanium targets such as TiAl?

A：Yes. Alloy targets like TiAl 50:50 at% are produced via powder metallurgy or vacuum melting to ensure homogeneous element distribution and prevent segregation-related coating defects.

Q: What is the difference between Indium and Diffusion bonding?

A：Indium bonding suits lower power densities and allows rebonding below 150°C. Diffusion bonding forms a strong metallurgical bond for high-power, high-throughput manufacturing lines requiring reliable heat dissipation.

Q: How do you prevent nodule formation on the target surface?

A：Our targets undergo high-density densification and strict microstructure optimization to minimize uneven erosion, significantly reducing nodule growth and particulate contamination during sputtering.